High-performance electronics generate high heat flows that are usually dissipated by air-based cooling concepts. However, air cooling has the disadvantages that it offers only limited cooling performance, requires a lot of space, the fans consume energy and can be noisy.
Evaporative cooling offers the highest heat transfer performance and can operate passively and therefore silently.
Current evaporation-based cooling concepts are mostly based on the "heat pipe" concept. Water is often used as a cooling medium in heat pipes. To cool high-performance electronics down to acceptable temperatures (e.g. 70 °C), low system pressures and thus complex evacuation as well as a tight, pressure-resistant system are required. Therefore, the medium is transported in metallic pipes, which do not allow a flexible design of the fluid transport.
Our goal is to develop a novel evaporative cooling concept using a synthetic cooling medium that has a low boiling temperature (about 50 °C) at ambient pressure. This allows the system to operate at ambient pressure and eliminates the need for pressure-resistant walls. In contrast to a heat pipe, a capillary structure is only required in the evaporator, so normal hoses can be used for fluid transport.
Contact: Prof. Dr. Boris Schilder, Justin Fey